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CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment

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The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is the second Notice of Funding Opportunity under this program and seeks applications for projects for the construction, expansion, or modernization of commercial facilities for semiconductor materials and manufacturing equipment. For more information, additional resources, and instructions on how to apply, please visit chips.gov. Note that all applications must be submitted through the CHIPS Incentives Portal at https://applications.chips.gov. If you have any questions on how to apply, please email apply@chips.gov.

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First seen 28 Sept 2026, last checked 29 Sept 2026. 1 recorded version.

  • 28 Sept 2026 · 4131a8208efc

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